The PS4’s cooling system is notoriously inefficient, and even at the best of times, thanks to its overworked fan, the console tends to sound like a jet plane that’s about to take off. While the games, tech, and price are going to be the most important factors for the PS5, there are many who hope that the console also employs a new and better cooling solution.
A new patent – originally filed a couple years ago but only recently published – describes what might be the new cooling system that Sony will have in place for the PlayStation 5 when it launches this Holiday. It mentions a heatsink, through holes, and heat conduction paths for what sounds in theory like a much more efficient solution that what Sony’s current-gen hardware uses.
“A heatsink is disposed on a lower surface of a circuit board,” the patent reads. “The circuit board has through holes that penetrate the circuit board in an area where an integrated circuit apparatus is disposed. Heat conduction paths are provided in the through holes. The heat conduction paths connect the integrated circuit apparatus 5 and the heatsink. This structure allows for disposition of a component different from the heatsink on the same side as the integrated circuit apparatus, thus ensuring a higher degree of freedom in a component layout.”
As is the case with any patent, this particular tech isn’t guaranteed to see the light of day- though it does at least suggest that a more effective cooling solution for the PS5 is something that Sony are actively working on. What form that ultimately ends up taking remains to be seen.
Earlier this year, reports emerged that Sony were investing in an “unusually expensive” cooling system for the PS5. Read more on that through here.
Recent reports have indicated that the PS5 might get a reveal even in May. Stay tuned to GamingBolt for any and all updates on that front.
